ESI's Total Solution Approach to eBeam Services

ESI is the founder and world leader in low voltage Electron Beam (EB) technology. Since 1970, we’ve helped many of the world’s leading and most recognized technology companies to invest wisely in ebeam solutions. 

At ESI, we are not just providing electron beam equipment, we are delivering a TOTAL SOLUTION to our clients. From proving your concept in our pilot facility, located in Wilmington, MA, to optimization of performance or cost, scale-up and/or pre-production, we have seven facilities located throughout the world to get you to market quickly, with as little risk as possible.

New technology can be risky, and Ebeam is no different – we understand this better than anyone. You have questions and ESI has the answers. Take advantage of our experience, know-how, and best-in-class supply chain partnerships. Let us show you how we can help.



Electron beam offers a wider range of physical properties than any other drying or curing technology. This is primarily due to the highly cross-linked cure of the inks, coatings, and laminating or PSA adhesives. Higher gloss. Lower matte finishes. Better scuff and abrasion resistance. Better chemical resistance. Highest heat resistance. And consistent COF with electron beam crosslinking.



ebeam inks, coatings, and laminating adhesives are FDA compliant and safe for food packaging. ebeam technology has been used in food packaging for over 40 years worldwide and for sterilizing devices. EB chemistries contain NO Odor or Extractables primarily because they contain NO Photoinitiators. Further, the beam processing are not flammable, toxic, or hazardous.



EB inks, coatings, and adhesives are 100% solids. They contain NO VOC’s. There are no initial regulatory filings or ongoing environmental H&S compliance. NO worries about VOC’s, explosion proofing, carbon taxes, CO2 emissions or government reporting. Additionally, there is no wasted energy in producing, mixing, shipping, drying, collecting and recovering, or incinerating solvents. Great for both the environment and the bottom line.



Choose your EZCure:

FlexoBeam – designed for today’s high speed CI Flexo presses curing wet-trapped inks, varnishes and adhesives

CR (Chill Roll) – ideal for thin gage, extensible, heat sensitive packaging films

LS (Low Speed) – low upfront cost EB for today’s web fed digital and inkjet printing presses

LP (Low Profile) – low entry height for web offset presses running thicker gauge films, papers and board stock

FC (Folding Carton) – side fire orientation designed specifically for today’s high speed web offset folding carton presses

SF (Side Fire) – ideal for high-speed, wide web Flexo, Gravure presses, solventless laminating, & ebeam coating lines

DF (Down Fire) – lowest entry height and direct coupled power supply offers smallest footprint for web offset presses

LAB (Lab Unit) – For a college or scientific lab.

ElectroCure Specifications:

Web width
600 mm to 3500 mm (20” to 140”)

Dose Speed
up to 13,000 kGy M/min

Depth of Penetration
up to 16 mils (400 gram/m2)

Power Supply
Gas-filled.  Direct-coupled or remote

Side-fire, Down-fire, Other

Drum (supported) or Unsupported

Web. Panel. Sheet.

CE Complaint